Items |
Standard |
Avanced |
Tolerance |
Remark |
PCB
Size |
HASL |
520*400 |
- |
|
thk.>1.0 |
380*320 |
- |
|
0.6 |
Electrolytical Ni/Au |
570*470 |
- |
|
0.6 |
Electroless Ni/Au |
570*470 |
- |
|
0.6 |
Entek |
570*470 |
- |
- |
0.6 |
V-CUT |
Bd Length?ü460 |
- |
|
1.0 |
Bd Thk. |
Single/Double Sided |
0.6 |
0.2 |
+/-15% |
/ |
4 Layers |
0.80-1.60 |
0.40-3.00 |
+/-10% |
<0.40
under evaluation |
6 Layers |
1.20-1.60 |
0.60-3.00 |
+/-10% |
<0.60
under evaluation |
8 Layers |
1.40-1.80 |
1.00-3.00 |
+/-10% |
>3.00
under evaluation
|
10 Layers |
1.60-2.00 |
1.20-3.00 |
+/-10% |
>3.00
under evaluation
|
12-16 Layers |
1.80-2.20 |
1.40-3.00 |
+/-10% |
>3.00
under evaluation
|
Conductor Width / Spacinag |
18umBase Copper+ 18umPlating Copper |
0.15/0.15 |
0.10/0.10 |
+/-20% |
/ |
35umBase Copper+18umPlating Copper |
0.20/0.20 |
0.18/0.18 |
+/-20% |
/ |
70umBase Copper+ 18umPlating Copper |
0.25/0.25 |
0.20/0.20 |
+/-20% |
>2oz under evaluation |
Hole Size |
Min. PTH Size |
0.30 |
0.10 |
+/-0.10 |
/ |
Max. PTH Size |
8.0 |
/ |
|
/ |
Min. Slot Size |
0.8 |
0.7 |
+/-0.10 |
/ |
Aspect Ratio |
Bd Thk/Min. Hole Size |
6.50 |
10 |
- |
/ |
Min. Annularity |
Hole Size 0.20-0.55 |
0.15 |
0.13 |
- |
For punching hole￡o0.25 min. |
Hole Size 0.60-0.75 |
0.2 |
0.15 |
- |
+0.052mm for inner layer |
Hole Size 0.80-3.50 |
0.25 |
0.20 |
- |
/ |
Hole Size￡? 3.50 |
0.80 |
- |
- |
/ |
Slot Length<2.5 |
0.30 |
- |
- |
/ |
2.5 |
0.80 |
- |
- |
/ |
Slot Length>5.0 |
1.50 |
- |
- |
/ |
Surface
Treatment |
Electroless Ni/Au |
Ni :3-5um |
Ni :4-6um |
- |
/ |
Flash Au :0.05-0.10um |
- |
- |
/ |
Thk Au:0.10-0.30um |
- |
- |
/ |
Electrolytical Ni/Au |
Ni :3-5um |
- |
- |
/ |
Au :0.5-1.0um |
Au :1.0-2.0um |
- |
Au:2.0-3.0um under evaluation |
Sloder Mask |
SM Thk |
0.025 |
0.03 |
- |
/ |
opening |
0.06 |
0.05 |
- |
/ |
Solder Mask Bridge |
0.10 |
0.08 |
- |
/ |
Component Mark |
Text Width |
0.15 |
0.10 |
- |
/ |
Text Height |
1.20 |
1.00 |
- |
/ |
Profiling |
Fab Dim. |
+/-0.20 |
+/-0.15 |
>100mm,plus Tolerance+/-0.05 each50mm |
Radius |
R0.50 |
R0.40 |
- |
/ |
V_CUT Angle |
30??/45??/60?? |
- |
- |
/ |
V_CUT Location |
+/-0.30 |
+/-0.25 |
- |
/ |
V_CUT Registration |
+/-0.50 |
+/-0.25 |
- |
/ |
Clearance between V_CUT to Outline |
10 |
8 |
- |
/ |
Warpage |
Dim. H/Dim. A |
1.0% |
0.05% |
- |
/ |
Isolater
ing |
NPTH to Conductor |
0.55 |
0.50 |
- |
/ |
Hole to Inner Layer Feature |
0.30 |
0.25 |
- |
/ |
Inner Layer Feature to outline |
0.55 |
0.50 |
- |
/ |
Location Tolerance |
Feature to Outline |
0.30 |
0.25 |
- |
/ |
Hole to Outline |
0.25 |
0.20 |
- |
/ |
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